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DANIEL BEEKER provides applications support and special function development tools and instrumentation for NXP Automotive customers worldwide. He has more than 43 years’ experience in electronics system design and EMC. He also specializes in EMC and signal integrity design techniques for systems and PCBs. He has completed more than 200 PCB design evaluations for customers and internal NXP products. He teaches field-based design techniques at NXP and industry conferences worldwide, more than 100 sessions with more than 5,000 attendees since 2010. He is also involved with NXP IC package design and IC development tool teams to support improved EMC performance, working on more than 20 IC designs.
ERIC BOGATIN, PH.D., received a bachelor’s in physics from MIT and a doctorate in physics from the University of Arizona. He has been active in the SI/PI field for 35 years. He was a featured columnist for PCD&F magazine for 10 years and a frequent speaker at PCB West. He focuses on training engineers on best measurement practices using high-performance scopes, TDRs and VNAs. He is an adjunct professor at the University of Colorado, Boulder, where he teaches printed circuit board design and high-speed digital design. In addition, he is the technical editor of the Signal Integrity Journal.
RALF BRUENING is product manager and senior consultant at the Zuken EMC Technology Center in Paderborn, Germany. Part of his responsibility is to help customers implement signal- and power- integrity analysis in PCB design flows and concrete project consulting and technology development. He holds degrees in computer science, electrical engineering and economics from the University of Paderborn. He has more than 30 years of experience in electronics and EDA. He is a regular speaker at international conferences and is involved in European Union-funded technology research and standardization activities (e.g. IBIS Open Forum).
ELIZABETH BUSTAMANTE is an electronics engineer, PCB designer and active IPC committee member. As the engineering program manager at SnapEDA, she is responsible for leading a team of engineers in the creation of PCB libraries, ensuring the team is constantly evaluating and improving its quality, processes, and efficiency. She has a bachelor’s in electronics engineering from the Universidad Pontificia Bolivariana.
ROBERT CARTER is vice president of marketing, business development, and technology for Oak-Mitsui’s FaradFlex embedded capacitance materials and support of advanced technology VSP copper. He has 32 years’ experience in printed circuits, advanced electronic materials, MEMs, RF modules, and chip packaging. He directs engineering, marketing, and sales worldwide. Carter initiated the startup of two major PCB factories in China, and led engineering, development, and applications organizations at companies such as Xerox, Toppan, Multi-Fineline Electronix, Rogers, Flex2Chip, and Panasonic Electronic Materials. He has studied chemical and
materials engineering and business management at California Polytechnic and Grand Canyon University.
KEVEN COATES has nearly 30 years’ experience in design engineering, most recently with Geospace Technologies, where he designed low-noise seismic recording devices, industrial battery testers/chargers, and battery interface circuits. He has worked on embedded processors, very low-noise circuits, high-power circuits, thermal design, battery safety, and battery management. He also spent 20 years working for Texas Instruments, specializing in high-speed PCB layout/signal integrity, BGA layout, thermal issues, and PCB-friendly BGA packaging for consumer and automotive applications. He holds a bachelor’s from Texas A&M.
PAUL COOKE has more than 30 years of experience in printed board (PWB) design and manufacturing. He has held senior positions in operations, quality, process engineering and field application engineering at some of the top North American PCB manufacturers. He recently joined AGC-Nelco Taconic as director of field application engineering and technical sales, where he focuses on working with designers in the avionics and space industry to design and develop products. He has served on a number of IPC technical committees to develop industry standards and received an award for contributions to IPC-9121, “Troubleshooting for Printed Circuit Boards.”
JOHN COONROD is technical marketing manager for Rogers, Advanced Connectivity Solutions Division. He has 33 years of experience in the OCB industry. About half of this time was spent in the flexible circuit industry, regarding circuit design, applications, processing and materials engineering. The past 18 years have been spent supporting high-frequency circuit materials involving circuit fabrication, providing application support and conducting electrical characterization studies. Coonrod is chair for the IPC-D24C High Frequency Test Methods task group and holds a bachelor’s in electrical engineering from Arizona State University.
MICHAEL CREEDEN, CID+, has over 43 years of industry experience as an educator, PCB designer, applications engineer and business owner. As technical director design education at Insulectro, he helps OEMs and fabricators achieve design success for best material utilization. He is a Master Instructor for the CID+ IPC Designer Certification program, was a primary contributor for the CID+ curriculum, and teaches IPC CID/CID+ courses through EPTAC. He founded San Diego PCB Design.
KELLY DACK, CID+, is a PCB designer and manufacturing liaison at KeyTronic. He has more than 30 years’ experience designing PCBs for aerospace, medical, telecom and gaming products. His background includes PCB design of rigid, multilayer, flex, rigid-flex and HDI boards, and CAD software demonstration and training. He is an IPC CID Designer Certification instructor.