Page 24 - 2020-PCBWest-VirtualShowGuide

PHIL MARCOUX has been involved with heterogeneous and related product design and manufacturing for over 40 years. He continues as a mentor for companies exploring new methods. The first company he founded suffered the consequences of poor heterogeneous product construction and only managed to survive by becoming one of the first full-service SMT design and manufacturing facilities in the US. After successfully selling that company, Marcoux went on to found one of the first chip-scale and wafer-level-packaging companies. This company was responsible for the creation of some of the early component bonding, wafer-plated, and through-silicon structures and methods enabling many heterogeneous products. That second company, ChipScale, was awarded over 40 patents for these. Virtually every cellphone has licensed and utilized the structures covered by these patents.
ATAR MITTAL is an electrical engineer who manages Sierra Circuits’ design and assembly divisions. Passionate about high-speed designs, he loves to write about signal integrity, controlled impedance, etc. He recently gathered all his notes for an e-book on PCB transmission lines and differential pairs in PCB transmission lines.
JAMIE PACAMARRA, CID, is a designer at Analog Devices, where she has created a range of designs for various applications and disciplines, while doing thermal, signal integrity, and mechanical management and analysis of boards using simulations and 3-D modeling. She has presented at local and global Analog Devices conferences. She has a bachelor’s in electronics engineering.
LEE RITCHEY is president of Speeding Edge and has been designing PCBs for more than 40 years, which have been aimed at the high- performance computing and video game market. He has designed more than 5,000 PCB stackups ranging from 4-layer video game PCBs to 36-layer backplanes. He has also taught more than 11,000 engineers and designers his seminars on signal integrity and PCB design. He has helped numerous fabricators learn to manufacture high-layer-count PCBs and backplanes. He was one of the original speakers at PCB West when it started in 1991.
HEMANT SHAH is group director of product management for PCB products at Cadence and is the Consortium Chair for IPC-2581 Consortium. He led the effort to create an industry-wide consortium of design and supply chain companies to advance the adoption of IPC- 2581, the standard for transferring PCB design data to manufacturing. Earlier, Shah managed the Allegro signal and power integrity products for PCB and IC packaging.
DANIEL SMITH, IPC CID+, has more than 35 years’ experience in all roles of the PCB design process (concept through manufacturing/ destruction). He has two US patents for EDA-related inventions and has programmed in a variety of software languages. He has taught a variety of PCB design courses, including HDI and other topics.
VERN SOLBERG is an independent consultant specializing in SMT and microelectronics design and manufacturing technology. He has served the industry for more than 30 years in areas related to commercial and aerospace electronic products and is active as an author and educator. He holds several patents for IC packaging innovations, including the folded-flex 3-D package technology, is author of Design Guidelines for Surface Mount and Fine-Pitch Technology, and is a speaker and instructor supporting several industry organization technical programs, including IPC and SMTA.
MIKE VINSON is president and COO of Averatek. He has over 35 years of experience in product development and marketing in electronics. He has been responsible for all aspects of product and process development activities and manufacturing operations. Today, he is responsible for the commercialization of the Averatek precursor catalytic ink, nanomaterials, and ink blocking materials. Prior to this, he served as program manager, Products and Services Group at SRI International. He has held management-level positions in business development, engineering and applied R&D for a range of companies, including Universal Instruments, Kulicke & Soffa, and TI. Vinson holds an MBA from the University of Pennsylvania, Wharton School and a bachelor’s in civil engineering from Texas Tech.
SUSY WEBB, CID, is a senior PCB designer with 40 years of experience. Her career includes experience in coastal and oceanographic oil exploration and monitoring equipment, point- to-point microwave network systems, and CPCI and ATX computer motherboards. Webb is a regular speaker at the PCB, IPC and international design conferences and consults for individual companies and PCEA chapters as well. Her presentations discuss practical implementation of complex engineering concepts into board layout, and methods to improve the overall design and flow of printed circuit boards. She is CID certified, a former writer/columnist for PCD&F, a chapter writer for Clyde Coombs’ Printed Circuits Handbook, and one of the judges for the annual TLA competition. Webb is also an active member of the PCEA Executive Board and education committee and is a member and past president of the Houston Chapter of the Designers Council.
YOSHI FUKAWA Yoshi Fukawa received his B.S. degrees in Electrical Engineering from Tokyo University of Science, Japan, in 1988. He received a certification of NARTE EMC Engineer in 2000. He used to be an EMC committee member of JEIDA in Japan and currently a member of IEEE Santa Clara Valley EMC Chapter. He is a founder of TechDream based in Silicon Valley who has been providing leading-edge EMC solutions carrying EMI simulation software, near- field EMI scanner and advanced PCB materials in US. He submitted several joint-papers to IEEE EMC Symposium, DesignCon and EMC Europe.