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KYUNGJIN “JIN” MIN was born in December 1962 in South Korea. He moved to the US in 1982 and has been living there since. He received his Ph.D. from the North Carolina State University in 1998. After working at LSI Logic and Perkin Elmer, he co-founded Amber Precision Instruments in 2006, where he has been the CEO since 2011. His interests include the development of EMC scan technologies and EMC scanners. He has authored and co-authored more than 20 publications and holds six patents. He was a member of the ESDA (Electrostatic Discharge Association) Standard Committee, involving component ESD and LU test standard revision as well as JEDEC and ESDA joint standard preparation.
GARY FERRARI has extensive experience in electronic packaging with an emphasis on printed board (PWB) design and manufacturing. He has held senior operations, quality and engineering positions in OEM and supplier environments, and served as executive director and cofounder of the IPC Designers Council. He has served on a number of IPC technical committees, including the IPC-2221/2222 Design subcommittee, and chaired the IPC Technical Activities Executive Committee. He has written numerous technical articles and provided design for manufacture (DfM) consulting services to the industry. Ferrari spearheaded IPC’s highly successful PWB Designers Certification Program, which has trained and recognized over 6,000 designers to date. He received the IPC President’s Award in 1990 and the IPC Raymond E. Pritchard Hall of Fame Award in 2015, recognizing his contributions to the electronic interconnection industry and the association.
MARK FINSTAD is senior application engineer at Flexible Circuit Technologies. He co-chairs the IPC-2223, Flexible Circuit Design standard, sits on IPC-6013, IPC-4202, IPC-4203 and IPC-4204 committees, and has over 35 years of experience designing and manufacturing flexible circuits for commercial, medical, and military/ avionics applications. He has authored articles in numerous trade magazines, and currently coauthors the “Ask the Flexperts” column for PCD&F magazine with Nick Koop.
MICHAEL FORD is senior director of emerging industry strategy at AegisSoftware.StartinghiscareerwithSony,includingeightyears working in Japan, he has been instrumental in creating and evolving revolutionary software solutions for assembly manufacturing. Today, he is an established thought leader for Industry 4.0 and digital smart factories, an active contributor to IPC industry standards, including the Connected Factory Exchange (CFX), traceability and secure supply-chain. In 2020, he received the IPC President’s Award for contributions to several standards that together now are leading to the formation of the new IPC Digital Twin standard. Michael also regularly contributes articles, columns and blogs in several leading industry publications.
BILL HARGIN is founder of Z-zero, a manufacturer of software for PCB stackup planning, material selection and characterization. He has authored multiple articles on signal integrity, is a regular columnist for PCD&F magazine, and more than 10,000 engineers and PCB designers worldwide have taken Hargin’s workshops on high- speed PCB design. With 25 years of experience dealing with PCB signal integrity, Hargin served as director of marketing for Mentor Graphics’ HyperLynx SI software and director of North American marketing for Nan Ya Plastic’s PCB laminate division.
RICK HARTLEY, a retired senior principal engineer at L-3 Avionics Systems, is principal of RHartley Enterprises, through which he consults and teaches internationally. His focus is on correct design of circuits and PC boards to prevent and/or resolve EMI, noise and signal integrity problems. He has consulted with major corporations in the US and 14 other countries. His career has focused on computers, telecommunications and aircraft avionics, as well as medical, automotive and appliances. He has taught seminars at numerous conferences, including the IEEE EMC Symposium, PCB West, IPC Apex Expo and others. He is on the board of directors of the Printed Circuit Engineering Association, a past member of the Editorial Review Board of Printed Circuit Design magazine and has written numerous technical papers and articles on methods to control noise, EMI and signal integrity.
MARK HUGHES is research director at Royal Circuit Solutions. Prior to Royal Circuit, he was technical editor for AllAboutCircuits. com and taught physics for 14 years. He holds bachelor’s and master’s degrees.
BEN JORDAN, CID+, has over 20 years of experience in embedded systems, FPGA and PCB design. Most recently, he was director of technical marketing at Altium, where he worked in R&D, technical support, product marketing and as a subject matter expert. In his spare time, he loves to experiment with board-level electronics and microcontrollers, as well as play guitar.
NICK KOOP is director of application engineering at TTM Technologies. He has developed and applied advanced PCB technologies to support a wide range of medical, military, and global security applications. He is vice chairman of the IPC Flexible Circuits Committee and co-chair for the IPC-6013 Qualification and Performance Specification for Flexible Printed Boards Subcommittee. Koop has over 35 years of experience in design, manufacture, and management in the flexible circuit industry. He coauthors the “Ask the Flexperts” column in PCD&F magazine.